CW021A | Cu-HCP

The micrographs show a single-phase (fcc), fine-grained microstructure. The hardness is 88 HV0,2.

Cu-HCP is a deoxidised, oxygen-free copper with a very low residual phosphorus content (<0.007 %). The alloy combines excellent formability and suitability for joining processes (welding, brazing) with high electrical conductivity. Areas of application are in electrical engineering, apparatus engineering and the cable industry.