CW024A | Cu-DHP

The micrographs show a single-phase (fcc), fine-grained microstructure. The hardness is 78 HV0,2.

Cu-DHP is a deoxidised, oxygen-free copper with a limited, high residual phosphorus content (max. 0.04 %). It has very good weldability and hard solderability (hydrogen resistance) as well as excellent deformation capacity (formability). Areas of application are components in electrical engineering, pipelines, roof and wall cladding as well as apparatus engineering.