CuP 179 Hard solder
Chemical designation | CuP 179 |
---|---|
State | Hartlot |
Etching | ungeätzt |
This brazing alloy contains 5.9 – 6.5% phosphorus. The microstructure consists of α solid solution (in which little phosphorus is dissolved) in a eutectic Cu-P matrix.
Chemical designation | CuP 179 |
---|---|
State | Hartlot |
Etching | ungeätzt |
This brazing alloy contains 5.9 – 6.5% phosphorus. The microstructure consists of α solid solution (in which little phosphorus is dissolved) in a eutectic Cu-P matrix.